According to reports, TSMC's 2nm process acceleration installation equipment is expected to be mass-produced in 2025. The semiconductor supply chain reports that TSMC's Baoshan Fab20 P1 plant in Hsinchu will begin equipment installation work in April to warm up the GAA (Surrounding Gate) architecture for mass production. It is expected that Baoshan P1, P2, and Kaohsiung's three advanced process wafer factories will all be mass-produced in 2025, attracting customers such as Apple, Nvidia, AMD, and Qualcomm to compete for production capacity. TSMC will not comment on this.