On December 4th, World Advanced released a press release stating that VSMC, a joint venture between World Advanced and NXP in Singapore, held a groundbreaking ceremony for its 12 inch wafer fab today. VSMC's first 12 inch wafer fab is expected to enter mass production in 2027, with a monthly production capacity of 55000 wafers in 2029, estimated to create approximately 1500 job opportunities. After the production of the first 12 inch wafer fab, World Advanced and NXP will evaluate the construction of a second wafer fab. On June 5th this year, World Advanced and NXP announced the establishment of a VSMC joint venture in Singapore to build a 12 inch wafer fab, with a total investment of approximately 7.8 billion US dollars.