On October 17th, TSMC updated the progress of its overseas factories at a press conference, mentioning that the construction of the second special process technology wafer fab in Kumamoto, Japan has begun, and the construction project is scheduled to begin in the first quarter of 2025. The second wafer fab will support the company's strategic customers in consumer, automotive, industrial, and HPC related applications, and is expected to begin production by the end of 2027.