Semiconductor packaging and testing manufacturer Sunrise announced on March 21 that it will launch a new interconnect technology called Chiplet to meet the diverse integration design and advanced packaging needs of small chips brought about by the development of artificial intelligence. This technology uses a new type of metal layer through microbump technology, which can significantly reduce the distance between chips and wafers. Sun and Moon stated that improving small chip level interconnection technology can expand application areas, in addition to AI chips, it can also be extended to key chips such as mobile application processors and MCU microcontrollers.