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Sun and Moon Launch Chiplet New Interconnection Technology to Meet the Advanced Packaging Needs of AI
Semiconductor packaging and testing manufacturer Sunrise announced on March 21 that it will launch a new interconnect technology called Chiplet to meet the diverse integration design and advanced pac ... -
Positive signals in semiconductor packaging and testing: Sun and Moon Show Performance, Advanced Packaging Equipment Manufacturer "Full of Orders"
Sealed testing giant Riyuguang disclosed its May performance yesterday. The company said that it benefited from the slow recovery of customer demand, and its May revenue reached a new high this year, ... -
Sun and Moon will add chip packaging and testing facilities in California
On June 26th, Wu Tianyu, the operating director of Sun Moon Optoelectronics, announced at a shareholder meeting in Kaohsiung that the company will add a testing facility in California, USA, in part t ...