首页 News 正文

On March 18th, sources reported that TSMC is considering building advanced packaging capacity in Japan, and discussions are still in the early stages. Sources say that TSMC is considering introducing its CoWoS packaging technology to Japan as a solution. (Reuters)
您需要登录后才可以回帖 登录 | 立即注册

本版积分规则

云海听松 新手上路
  • 粉丝

    0

  • 关注

    0

  • 主题

    2