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TSMC CEO: The chip market is very close to the bottom
The CEO of TSMC stated that the chip market is very close to the bottom, and AI demand will continue to be the driving force for growth; We do see some early signs of stabilization in the PC and smar ... -
NIO releases its first self-developed intelligent driving chip, the Shenji NX9031
On December 23rd, NIO released its first self-developed intelligent driving chip - the Shenji NX9031. It is reported that the Shenji NX9031 adopts a 5nm automotive standard process and has over 50 bi ... -
SK Hynix and TSMC reportedly formed an AI chip alliance to collaborate on the development of HBM4
On February 8th, it was reported that SK Hynix and TSMC have formed an AI chip alliance to develop HBM4. South Korean chip manufacturer SK Hynix is forming an alliance with TSMC to promote their arti ... -
Media: AMD's sale of "special edition" chips to China is hindered and requires permission to export
According to sources cited by the media, AMD's artificial intelligence (AI) chips specially customized for the Chinese market have not been approved by the US Department of Commerce. If the company w ... -
Is the Pentagon going to rely on funding for Intel chips? US chip subsidies continue to face funding shortages
The progress of the chip project in the United States seems to be not going smoothly. According to insiders, the Pentagon has cancelled its plan to provide $2.5 billion in chip funding to Intel and i ... -
Global chip sales continue to grow, and the United States issues the fifth large subsidy under the chip bill
The US government is issuing large subsidies one after another to attract chip manufacturers to invest in building factories in the US. On April 8th, the US Department of Commerce announced that it w ... -
Microsoft is about to expand its strategy! Open AMD chips and self-developed Cobalt 100 chips to cloud customers
Microsoft plans to provide Azure cloud computing customers with an Azure service based on AMD artificial intelligence chips, and specific details will be announced at next week's Build Developer Conf ... -
TSMC is reportedly exploring new chip packaging technologies
On June 20th, it was reported that TSMC is exploring new chip packaging technologies. Several insiders have stated that TSMC is collaborating with equipment and material suppliers to develop this new ... -
AI demands increasingly high computing power. TSMC is reportedly developing new advanced chip packaging technology
According to sources cited by media, TSMC is developing a new advanced chip packaging technology aimed at meeting the computing power requirements of future artificial intelligence (AI). According to ... -
The global semiconductor market is accelerating its growth, with logic chips and storage chips leading the recovery
The global semiconductor market is experiencing a strong recovery, with logic chips and storage chips leading the recovery. In June of this year, the World Semiconductor Trade Statistics Organization ... -
NIO Innovation Technology Day releases achievements such as the Tianshu operating system and self-developed chips
On July 27th, the NIOIN 2024 Innovation and Technology Day, with AI as the main theme, was successfully held at the Shanghai World Expo Center. NIO founder, chairman, and CEO Li Bin, together with NI ...