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Intel Continues to Advance Moore's Law: Backside Power Supply of Chips Breaks through Interconnection Bottlenecks
On December 9th, Intel demonstrated the key technology of using back power contacts to shrink transistors to a range of 1 nanometer or more at the IEDM 2023 (IEEE International Conference on Electron ... -
JinkoSolar leads TOPCon technology upgrade, improving efficiency on the back and boosting overseas market demand
After frequent policy winds and breakthroughs in technological routes, the photovoltaic industry, which has cleared outdated production capacity, is emerging from a low point and becoming a high grow ...