Intel CEO confirms that the next generation CPU releases 3 nanometers from TSMC. Intel CEO at Gelsinger confirms that the collaboration with TSMC has progressed from a 5-nanometer process to 3 nanometers. Gelsinger stated that the computing chip blocks (CPU tiles) of Arrow Lake and Lunar Lake, which will debut as early as the fourth quarter of 2024, will use TSMC's 3-nanometer process.