On October 28th, Intel announced the expansion of its Chengdu packaging and testing base. The base will provide packaging testing services for server chips on the basis of existing client product packaging testing, and establish a customer solution center to improve the efficiency of the local supply chain, increase support for Chinese customers, and improve response speed. The relevant planning and construction work has been initiated.
According to Intel's expansion plan for its Chengdu base, its new production capacity will be focused on providing packaging and testing services for server chips, in response to Chinese customers' demand for energy-efficient and customized packaging solutions. The upcoming Intel Customer Solutions Center will become a one-stop platform for driving enterprise digital transformation, working together with customers and ecosystem partners to provide customized solutions based on Intel architecture and products for industry customers, accelerating the implementation of industry applications.