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Taiwanese media: TSMC will offer a price discount of approximately 2% for some mature processes next year
According to Taiwan's Economic Daily on November 27th, citing information from the IC design industry, TSMC will resume price discounts for some mature processes next year, with a discount of around ... -
TSMC reported to reduce the price of 7nm process by approximately 5% -10%
According to Taiwan's Industry and Commerce Times, supply chain news indicates that TSMC will truly lower its price for the 7nm process, with a reduction of about 5% -10%, to alleviate the decline in ... -
TSMC is actively expanding its CoWoS process and plans to build its seventh advanced packaging and testing plant. The site has been selected recently
According to equipment manufacturers, TSMC is actively expanding its CoWoS process and plans to build a seventh advanced packaging and testing plant, which has recently begun site selection. -
Reported that TSMC has successfully achieved the 2nm process of GAA technology
The report states that TSMC has successfully achieved the 2nm process of GAA technology. -
It is reported that Broadcom has suspended the sales process of its security software business Carbon Black
On February 26th, sources revealed that Broadcom has suspended the sale process of its security software business Carbon Black. Including debt, the company's value may be around $1 billion. Broadcom ...- xurongdadi
- 2024-2-27
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TSMC's 6/7nm process will reduce prices by 10% starting from early 2025
According to reports, the price of TSMC's 6/7nm process will decrease by 10% starting from the beginning of 2025. With a capacity utilization rate of only 60%, the price of TSMC's 6/7nm nodes will de ... -
TSMC: Customers are actively shifting towards 2nm process technology
TSMC stated that customers are actively transitioning to 2nm process technology. -
TSMC considers raising prices for 3nm process and CoWoS advanced packaging
According to Morgan Stanley's latest report, TSMC is considering raising prices for its 3nm process and CoWoS advanced packaging technology to cope with the surge in market demand. TSMC plans to impl ... -
TSMC considers raising prices for 3nm process and CoWoS advanced packaging
On November 4th, according to Morgan Stanley's latest report, TSMC is considering raising prices for its 3nm process and CoWoS advanced packaging technology to cope with the surge in market demand. T ...