Industry insiders have revealed that TSMC's investment in advanced process research and development will continue to grow next year. However, it is expected that about 80% of some advanced process equipment with a size of 3 nanometers will be shared with those with a size of 5 nanometers and 7 nanometers. With the utilization rate of 7nm production capacity in the seasonal transition stage, it is expected that capital expenditure next year will focus on advanced processes of 3nm and below 2nm, as well as investment in light masks. In terms of continuous mature processes, it will increase the proportion of special processes and upgrade some equipment for advanced packaging.