According to a research report by TrendForce Consulting, since the second quarter, chip companies such as AMD have actively approached TSMC and OSAT companies to use FOPLP technology for chip packaging, driving industry attention to FOPLP technology. It is estimated that the current development of FOPLP packaging technology in the mass production of consumer IC and AI GPU applications may fall between the second half of 2024 to 2026, and between 2027 and 2028, respectively.