According to reports, Nvidia plans to import GB200 into panel level fanout packaging earlier. In order to alleviate the tight production capacity of CoWoS advanced packaging, Nvidia is planning to import its GB200 into panel level fanout packaging earlier, from the original plan of 2026 to 2025. The relevant report also confirms the relevant information and points out that the Nvidia GB200 supply chain has been launched and is currently in the design, fine-tuning, and testing stage; Based on the analysis of CoWoS's advanced packaging capacity, it is estimated that 420000 GB200 units will be delivered to the downstream market in the second half of this year, with an output of 1.5 to 2 million units next year. Overall, in the trend of CoWoS production capacity shortage, the industry expects panel level fanout packaging, which is also advanced packaging, to become a powerful tool to ease the supply of AI chips.