TSMC's CoWoS production capacity is fully loaded, and AMD is seeking cooperation with other CoWoS packaging manufacturers. AMD's development of AI chips has exceeded market expectations, and the MI300 product is expected to push global AI business opportunities to white hot. However, the key to supply still lies in advanced packaging capacity, and AMD will seek support from packaging and testing factories for CoWoS like products. Due to TSMC's CoWoS production capacity already being fully utilized, it will take six to nine months to establish a new production line. Therefore, it is expected that AMD will seek cooperation from other companies with similar CoWoS packaging capabilities, with Sun Yueguang, Amkor, Licheng, and Jingyuan Electric as potential partners in the first batch.